Module having a stacked passive element and method of forming the same
US8153473B2 · kind B2 · utility
17Cited by
131References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2008 |
| Grant date | Apr 10, 2012 |
| Priority date | — |
| Expiry date | May 24, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A module having a discrete passive element and a semiconductor device, and method of forming the same. In one embodiment, the module includes a patterned leadframe, a discrete passive element mounted on an upper surface of the leadframe, and a thermally conductive, electrically insulating material formed on an upper surface of the discrete passive element. The module also includes a semiconductor device bonded to an upper surface of the thermally conductive, electrically insulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.