Modular low stress package technology
US8153474B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2010 |
| Grant date | Apr 10, 2012 |
| Priority date | — |
| Expiry date | Oct 13, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a protected package assembly: providing a protective modular package cover in accordance with a modular design; selectively applying an adhesive to the cross member of each subassembly receiving section of the protective modular package cover that will receive a subassembly to form an adhesive layer of the protective modular package cover; encapsulating the one or more subassemblies in the subassembly receiving sections on the selectively applied adhesive layer to generate a protected package assembly; and controlling application of a distributed downward clamping force applied to the top surfaces of the subassemblies received by the protective modular package cover and useful for mounting the protected package assembly to a core through activation of fastener elements and cross members of the subassembly receiving sections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.