Method for fabricating multilayer circuit board, circuit plate, and method for fabricating the circuit plate
US8153901B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 30, 2006 |
| Grant date | Apr 10, 2012 |
| Priority date | — |
| Expiry date | Jun 13, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer circuit board is fabricated by: preparing a film comprising a first protective film and a first interlayer adhesive; preparing a first circuit board having a first base and a conductive post protruding therefrom; stacking the first interlayer adhesive and the conductive post together; peeling off the first protective film; preparing a second circuit board including a conductive pad receiving the conductive post; and bonding the first circuit board and the second circuit board through the first interlayer adhesive so that the conductive post and the conductive pad face each other, wherein the first interlayer adhesive 104 at the top portion of the conductive post is selectively removed while peeling off the first protective film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.