Module comprising radiation-emitting semiconductor bodies
US8154031B2 · kind B2 · utility
10Cited by
5References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2006 |
| Grant date | Apr 10, 2012 |
| Priority date | — |
| Expiry date | Apr 12, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A module comprising a regular arrangement of individual radiation-emitting semiconductor bodies (1) which are applied on a mounting area (6) of a carrier (2), wherein a wire connection is fitted between two adjacent radiation-emitting semiconductor bodies (1) on a top side, opposite to the mounting area (6), of the two radiation-emitting semiconductor bodies (1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.