Light-emitting diode arrangement and method for producing the same
US8154040B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2007 |
| Grant date | Apr 10, 2012 |
| Priority date | — |
| Expiry date | Sep 25, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side (101) and which are fixed by their rear side (102)—opposite the front side—on a first main face (201) of a common carrier body (2), wherein the semiconductor chips consist of a respective substrateless semiconductor layer stack (1) and are fixed to the common carrier body without an auxiliary carrier, and to a method for producing such a light-emitting diode arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.