Sensor element structure, sensor element array, and manufacturing method of sensor element array
US8154722B2 · kind B2 · utility
11Cited by
2References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 22, 2007 |
| Grant date | Apr 10, 2012 |
| Priority date | — |
| Expiry date | Nov 5, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/258
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Even when only a few antigens exist in a specimen, a change in a dielectric constant and a change in an optical spectrum accompanied thereto in the periphery of a conductive member are made larger, so that sensing at high sensitivity can be performed. A structure including a protrusion including a dielectric material protruded on a substrate and a conductive member provided on a first surface of the protrusion, in which the maximum value of the cross-sectional area in the cross-section in parallel with a first surface of the conductive member is larger than the area of the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.