High density switching platform with interbay connections arrangement
US8154867B2 · kind B2 · utility
45Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2010 |
| Grant date | Apr 10, 2012 |
| Priority date | — |
| Expiry date | Jul 14, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high density switching platform arranges multiple circuit cards interconnected by a single backplane. A single backplane has three sets of circuit cards on one side. A shared ventilation chamber on the other side of the backplane draws ambient air through each of the three sets of circuit cards independently. The air flow also allows cooling of power modules that supply power to the circuit cards. The platform allows interconnection of its circuit cards with circuit cards in adjacent platforms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.