Radiation-shielded semiconductor assembly
US8154881B2 · kind B2 · utility
1Cited by
26References
66Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 13, 2007 |
| Grant date | Apr 10, 2012 |
| Priority date | — |
| Expiry date | Sep 21, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A radiation-shielded semiconductor assembly includes at least one radiation-shielding lamina within the package. In some embodiments, a semiconductor assembly includes a microelectronic component, and at least one radiation-shielding layer affixed to a surface of the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.