Apparatus to manufacture a semiconductor package having a buffer disposed adjacent to a process unit of the apparatus
US8156636B2 · kind B2 · utility
0Cited by
6References
13Claims
0Family size
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Key dates
| Filing date | Sep 17, 2009 |
| Grant date | Apr 17, 2012 |
| Priority date | — |
| Expiry date | May 19, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/17
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus to manufacture a semiconductor package is provided. A die attaching process and/or a wire bonding process for first and second surfaces of a lead frame are sequentially performed inside the apparatus. Thus, time required for a semiconductor packaging process decreases and yield is increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.