Sensor in a moulded package and a method for manufacturing the same
US8156815B2 · kind B2 · utility
3Cited by
24References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2010 |
| Grant date | Apr 17, 2012 |
| Priority date | — |
| Expiry date | Jul 12, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49158
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The flow sensor or other type of sensor comprises a package having a cylindrical section arranged between an anchor section and a head section. The diameter of the anchor section is typically larger than the diameter of the cylindrical section, which in turn is typically larger than the diameter of the head section. A sensor chip is embedded partially into the package, with a sensitive area being exposed to the surroundings. The sensor can e.g. be inserted into a bore having a diameter matching the one of the cylindrical section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.