Integrated liquid to air conduction module

US8157001B2 · kind B2 · utility

Assignee

• Cooligy, Inc. · US

Inventors

• James Hom · Redwood City, US
• Girish Upadhya · Cupertino, US
• Douglas E. Werner · Santa Clara, US
• Mark Munch · Los Altos Hills, US
• Paul Tsao · Los Altos, US
• Bruce Conway · Doylestown, US
• Peng Zhou · Newtown, US
• Richard Grant Brewer · Palo Alto, US

Key dates

• Filing date: Mar 30, 2007
• Grant date: Apr 17, 2012
• Expiry date: Dec 15, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.