Silver polyamide composite
US8158140B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2008 |
| Grant date | Apr 17, 2012 |
| Priority date | — |
| Expiry date | Oct 27, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/372
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polymer composite comprising a thermoplastic polyamide polymer compounded with an organo-disulfide additive and a silver-based antimicrobial agent is disclosed. The organo-disulfide additive inhibits undesirable discoloration of the thermoplastic polyamide polymer including one or more silver-based antimicrobial agent. Processes for preparing the composite are also disclosed, including compounding the organo-disulfide additive in a polymeric carrier with the silver-based antimicrobial agent, then with the thermoplastic polyamide polymer, or compounding the organo-disulfide additive with the thermoplastic polyamide polymer before adding the silver-based antimicrobial agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.