Imaging system with relaxed assembly tolerances and associated methods
US8159602B2 · kind B2 · utility
0Cited by
13References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2008 |
| Grant date | Apr 17, 2012 |
| Priority date | — |
| Expiry date | Dec 23, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An imaging system includes an extended depth of field (EDOF) optical system, a sensor on a sensor substrate, and a securing mechanism adapted to secure the EDOF optical system directly to the sensor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.