Circuit board and method of mounting electronic component on printed board
US8159827B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 22, 2008 |
| Grant date | Apr 17, 2012 |
| Priority date | — |
| Expiry date | May 22, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
When U-shape formed electronic components having an axial lead shape are mounted upright on a printed board, two U-shape formed electronic components having an axial lead shape are arranged so as not to be in the same straight line, and a wiring pattern is formed in a state where bent-side lead wires have the same electric potential, and the electronic components are inclined so as to place the bent-side lead wires close to each other, whereby the electronic components that tend to fall in the inclined direction can be mutually supported by the bent-side lead wires. Thus, the electronic components can be prevented from falling without spoiling a heat dissipation performance of the electronic component and the board, and without greatly deteriorating an assembly performance of the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.