Leveling method for burying evaporating section of heat pipe into thermally conductive seat
US8161644B2 · kind B2 · utility
3Cited by
0References
9Claims
0Family size
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Key dates
| Filing date | Jun 3, 2009 |
| Grant date | Apr 24, 2012 |
| Priority date | — |
| Expiry date | Dec 2, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49373
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat is provided for an assembly of heat pipe and heat-conducting seat by simultaneously making the evaporating section of heat pipe partially formed into a flat surface when the evaporating section of heat pipe is being burying into the thermally conductive seat. Furthermore, in cooperation with a stamping machine, the leveling method is to make a multiple steps of press-fitting process to an evaporating section of heat pipe under a condition that there is no need to change the stamping die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.