Wiring structure for use in micro piezoelectric pump
US8162628B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2008 |
| Grant date | Apr 24, 2012 |
| Priority date | — |
| Expiry date | Jan 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/503
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
An electrical connection structure for use in a micro piezoelectric pump is disclosed. The electrical connection structure includes a driving circuit board and a multilayered wiring structure. The electrical connection structure includes the driving circuit board, the wiring structure, and a piezoelectric element arranged from top to bottom. The driving circuit board is provided with a driving circuit for driving the piezoelectric element and at least an electrical contact, wherein the electrical contacts are electrically connected to the driving circuit. A first electrode contact region and a second electrode contact region electrically insulated from each other are defined on the same surface of the piezoelectric element. The wiring structure sends a signal from the electrical contacts to the first electrode contact region and the second electrode contact region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.