Superfine copper alloy wire and method for manufacturing same
US8163110B2 · kind B2 · utility
1Cited by
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9Claims
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Key dates
| Filing date | Apr 8, 2008 |
| Grant date | Apr 24, 2012 |
| Priority date | — |
| Expiry date | Feb 7, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12896
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A superfine copper alloy wire has a copper-silver alloy wherein the superfine copper alloy wire has a final wire diameter of 0.05 mm or less, and the copper-silver alloy has a copper-silver eutectic crystal phase whose volume ratio to a whole volume of the superfine copper alloy wire is 3% or more and 20% or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.