Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus
US8163599B2 · kind B2 · utility
2Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2009 |
| Grant date | Apr 24, 2012 |
| Priority date | — |
| Expiry date | Mar 30, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249954
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip-chip mounting apparatus has a shield film (18) on the side of a pressurizing film (10b) of a tool protection sheet (10). When a semiconductor chip (1) is heated and pressurized via the tool protection sheet (10), the pressurizing film (10b) is released from a mold by a sheet fixing jig (9), and is expanded by a pressurizing/heating tool (11) to abut against an insulating resin film (5) protruding from the periphery of the semiconductor chip (1) and cure the insulating resin film (5) with an external pressure being applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.