Adhesive compositions, micro-fluid ejection devices and methods for attaching micro-fluid ejection heads
US8163819B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2010 |
| Grant date | Apr 24, 2012 |
| Priority date | — |
| Expiry date | Apr 27, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1601
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.