Integrated circuit structure and a method of forming the same
US8164167B2 · kind B2 · utility
6Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 29, 2008 |
| Grant date | Apr 24, 2012 |
| Priority date | — |
| Expiry date | Jun 13, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An integrated circuit structure is disclosed. The integrated circuit structure includes a first package substrate including a radiating element, the radiating element having a radiating element connection extending from the radiating element. The integrated circuit structure further includes a first chip positioned adjacent to the radiating element connection, the first chip having a first chip connection on a surface of the first chip, wherein the first chip connection forms a capacitive coupling with the radiating element connection. A method of forming an integrated circuit structure is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.