Patent · US Active

Electronic component module and method for production thereof

US8164177B2 · kind B2 · utility

5Cited by

1References

14Claims

0Family size

Assignee

OSRAM GmbH · DE

Inventors

Richard Matz · Bogen, DE
Ruth Männer · Höhenkirchen-Siegertsbrunn, DE
Steffen Walter · Gaimersheim, DE

Key dates

Filing date	Jan 10, 2007
Grant date	Apr 24, 2012
Priority date	—
Expiry date	Jun 25, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/10
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic component module comprising at least one ceramic circuit carrier (2, 3) and a cooling device with at least one heat sink (4), a bonding region arranged between the ceramic circuit carrier (2, 3) and the cooling device adapted for bonding the circuit carrier (2, 3) to the cooling device (4). The bonding region (5, 7; 6, 8) comprises a bonding layer comprised of metal and a eutectic region (7, 8).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.