Semiconductor device
US8164191B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 27, 2009 |
| Grant date | Apr 24, 2012 |
| Priority date | — |
| Expiry date | Dec 14, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
Abstract
A semiconductor device including a semiconductor element and a functional member fixed thereto with an adhesive film is provided, where the performance or reliability degradation due to moisture entered by way of the adhesive film itself or the interfaces between the adhesive film and members adjacent thereto can be suppressed with a simple structure. The semiconductor element has an active region for realizing a predetermined function, formed on a surface of the element. The functional member has a predetermined function and is fixed on a surface side of the semiconductor element with the adhesive film. A metal film covers a region including at least all outer side faces of the semiconductor element, all outer side faces of the adhesive film, an interface between the adhesive film and the semiconductor element, and an interface between the adhesive film and the functional member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.