Enclosure of electronic device
US8164900B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 3, 2010 |
| Grant date | Apr 24, 2012 |
| Priority date | — |
| Expiry date | Nov 18, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/188
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An enclosure of an electronic device includes a bottom plate, a rear plate connected to the bottom plate, and a power supply unit. A heat generation apparatus is located on the bottom plate. An opening is defined in the rear plate. A power supply unit includes a wide first receiver portion and a narrow second receiver portion. A fan is mounted in the wide first receiver portion. The wide first receiver portion includes a rear wall located in the opening and a first front wall that is parallel to the rear wall. The first front wall and the rear wall define vent holes. The narrow second receiver portion includes a second side wall perpendicular to the first front wall. The second side wall and the heat generation apparatus form an air flow channel therebetween. The fan drives air flow through the air flow channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.