Electronic component module

US8164904B2 · kind B2 · utility

Assignee

• OSRAM GmbH · DE

Inventors

• Richard Matz · Bogen, DE
• Bernhard Siessegger · Danvers, US
• Steffen Walter · Gaimersheim, DE

Key dates

• Filing date: Apr 11, 2007
• Grant date: Apr 24, 2012
• Expiry date: Aug 25, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic component module includes at least one first multi-layer circuit board module (21, 22; 31, 32; 41, 42) and a cooling arrangement (23, 33, 43), the cooling arrangement (23, 33, 43) being in contact with an upper side of the circuit board module (21, 22; 31, 32; 41, 42). The cooling arrangement (23, 33, 43) is designed such that waste heat generated during operation of the electronic component module (2, 3, 4) is extracted in a lateral direction with relation to the arrangement of the circuit board module (21,22; 31, 32; 41, 42) by the cooling arrangement (23, 33, 43).