Thermal management of implantable medical devices
US8165694B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2009 |
| Grant date | Apr 24, 2012 |
| Priority date | — |
| Expiry date | Jul 31, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02J2310/23
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Systems and techniques for thermal management of implantable medical devices. In one aspect an implantable device includes an active component configured to perform medical activities, a charging component configured to convert energy from outside a body in which the implantable device is implanted into potential energy, and a thermal barrier between the charging component and the active portion. The thermal barrier thermally isolates the charging component from the active portion so that thermal resistance between the charging component and the active component is above the thermal resistance between the charging component and the body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.