Mapping a class, method, package, and/or pattern to a component
US8166077B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2008 |
| Grant date | Apr 24, 2012 |
| Priority date | — |
| Expiry date | Jan 3, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2201/865
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A program product, apparatuses, and methods provide for the collection of profile information for a component of a software program by generating a data structure that maps at least one method to a component. The method includes a name, and the data structure maps the method to the component using at least a portion of the name of the method. A class or pattern may also be mapped to a component. Furthermore, during profiling, a statistic associated with the execution of the method is determined; the data structure is accessed using the name of the method to determine the associated component; and the determined statistic is associated with the determined component. By doing so, method level and class level information can be aggregated to improve profiling, often leading to a clearer picture of which components are contributing to the performance and memory footprint of large scale software programs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.