Method of manufacturing a printed circuit board
US8166650B2 · kind B2 · utility
18Cited by
21References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 30, 2008 |
| Grant date | May 1, 2012 |
| Priority date | — |
| Expiry date | Nov 26, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a printed circuit board (PCB) includes of disposing thermal transfer vias and electrical vias through the PCB. The method further includes filling holes of the vias with a solder mask. The thermal transfer vias are filled to about 70% of capacity while the electrical vias are completely filled. Once filled, surfaces of the PCB are coated with an organic solderability preservative.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.