Apparatus for an enhanced magnetic plating method
US8168045B2 · kind B2 · utility
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3References
9Claims
0Family size
Assignee
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Key dates
| Filing date | May 20, 2011 |
| Grant date | May 1, 2012 |
| Priority date | — |
| Expiry date | May 20, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/07
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.