Thermosetting resin composition
US8168729B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2006 |
| Grant date | May 1, 2012 |
| Priority date | — |
| Expiry date | Apr 5, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4676
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The object of the present invention is to provide a thermosetting resin composition which can provide a cured material which is excellent in heat resistance, electrical properties, and flexibility, and has storage stability before curing, and in order to achieve the object, the present invention provide a thermosetting resin composition containing a polyurethane resin (A) which has the structure represented by the following general formula (1) and/or the general formula (2), and an epoxy resin (B).(In the chemical formulae, X represents a residue in which two phenolic hydroxyl groups are excluded from a phenol compound having two or more phenolic hydroxyl groups in the molecule.)
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.