Bonding device
US8168920B2 · kind B2 · utility
4Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2008 |
| Grant date | May 1, 2012 |
| Priority date | — |
| Expiry date | Feb 9, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonding device includes a bonding head including a bonding tool for sucking and holding an electronic component, and a laser heater for heating the electronic component by irradiating laser light on the electronic component held by the bonding tool from an inside of the bonding head, the laser heater including a collective unit for condensing laser light emitted from a light source. A focusing point of the laser light condensed by the collective unit is formed inside the bonding head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.