Interface techniques for coupling a sensor to a readout circuit
US8168936B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2011 |
| Grant date | May 1, 2012 |
| Priority date | — |
| Expiry date | Jun 17, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/803
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Techniques are disclosed that can be used to interface a sensor circuit with readout circuitry. The techniques can be employed, for instance, with microchannel plate (MCP) based devices used in numerous sensing/detection applications, and are particularly suitable for applications where it is desirable to interface an MCP having a relatively large active area to a readout circuit having a relatively smaller active area. The interface effectively decouples anode geometry from readout circuit geometry and also may be configured with flexible anode pad geometry, which allows for compensation of optical blur variations as well as a very high fill factor. The interface can be made using standard semiconductor materials and photolithography techniques and can be configured with thermal expansion qualities that closely track or otherwise match that of the readout circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.