Thermal head and printer
US8169452B2 · kind B2 · utility
2Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2009 |
| Grant date | May 1, 2012 |
| Priority date | — |
| Expiry date | Jun 25, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J25/312
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal head has a heat storage layer bonded onto a surface of the substrate, a heating resistor provided on the heat storage layer, and a pair of electrode portions connected to the heating resistor. The heating resistor has a heating portion which does not overlap the pair of electrode portions. A hollow portion is provided in a region of at least one of the surface of the substrate and a surface of the heat storage layer, the region being opposed to the heating resistor. A center line of the hollow portion is shifted with respect to a center line of a heating portion of the heating resistor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.