Power electronics substrate for direct substrate cooling
US8169779B2 · kind B2 · utility
20Cited by
30References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2009 |
| Grant date | May 1, 2012 |
| Priority date | — |
| Expiry date | Dec 20, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/908
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.