Tester bundle
US8170829B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2008 |
| Grant date | May 1, 2012 |
| Priority date | — |
| Expiry date | Apr 24, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L43/50
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
An apparatus for testing multiple Small Form-Factor Pluggable Plus (SFP+) ports comprising: a first testing module; a second testing module; and a communications link coupled with the first and the second testing modules; wherein each of the testing modules includes: a SFP+ interface connectable to a port under test (PUT), a signal processing circuit including: a signal compensator configured to perform signal compensation on a signal received from the other testing module, and a signal modifier configured to: modify the compensated signal according to a set of predetermined modification parameters, and transmit the modified signal to the PUT.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.