Patent · US Active

Method of providing low footprint optical interconnect

US8171625B1 · kind B1 · utility

10Cited by
12References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 2, 2009
Grant dateMay 8, 2012
Priority date—
Expiry dateJun 2, 2029

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49144
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.