Gripper, in particular a Bernoulli gripper
US8172288B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 2008 |
| Grant date | May 8, 2012 |
| Priority date | — |
| Expiry date | Nov 7, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S294/907
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A gripper for holding two-dimensional components with a low degree of loading, has a clamping ring connected to a controllable robot arm with a baffle plate connected to the clamping ring by a funnel-shaped component and has a gripping face which communicates with a flow system which passes through the funnel-shaped component and the baffle plate. After an excess pressure has been applied to the gripper, a negative pressure is produced on the gripping face in order to attach by suction a wafer to be gripped. A rubberized bearing surface of a bearing ring integrated in the gripping face provides a slip-resistant movement of the wafer. A sensor detects the wafer hat is attached to the gripping face by suction. In order to permit an extremely shock-resistant attachment of the wafer to be gripped on the gripping face of the gripper, a damping device which is circumferentially adapted to the gripper has a contour as viewed in plan that protrudes circumferentially above the contour of the gripper and forms a damping resistance for the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.