Smart card heat sink
US8172619B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 20, 2007 |
| Grant date | May 8, 2012 |
| Priority date | — |
| Expiry date | Mar 24, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink for a smart card, the heat sink having a contact plate having a contact surface, a riser extending upward from the contact plate, and a hook extending upward from the contact plate and located opposite the riser is disclosed. A smart card socket having a frame having a slot for receiving a smart card, the slot being defined by at least one wall, and a smart card heat sink at least partially abutted to the at least one wall is also disclosed. Finally, a method of transferring heat energy away from a smart card, comprising the steps of associating a smart card heat sink with a smart card socket and positioning at least a portion of the smart card heat sink between at least a portion of a smart card and at least a portion of the smart card socket is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.