Medical device encapsulated within bonded dies

US8172760B2 · kind B2 · utility

Assignee

• Medtronic, Inc. · US

Inventors

• Michael F. Mattes · Chandler, US
• Paul F. Gerrish · Phoenix, US
• Anna J. Malin · Mesa, US
• Tyler Mueller · Phoenix, US
• Geoffrey Batchelder · Sunnyvale, US
• Clark B. Norgaard · Phoenix, US
• Michael A. Schugt · Windom, US
• Ralph B. Danzl · Tempe, US
• Richard J. O'Brien · Minneapolis, US

Key dates

• Filing date: Jun 18, 2009
• Grant date: May 8, 2012
• Expiry date: Jun 30, 2030

Classification

• Technology area (CPC A): Human Necessities
• CPC primary: A61N1/3758
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

An implantable medical system includes a first die substrate with a first outer surface. The system also includes a second die substrate with a second outer surface. Furthermore, the system includes a medical device with a first portion that is mounted to the first die substrate and a second portion that is mounted to the second die substrate. The first and second die substrates are fixed to each other and substantially hermetically sealed to each other. Also, the medical device is substantially encapsulated between the first and second die substrates. The first portion is electrically connected to the second portion. Moreover, the first and second outer surfaces of the first and second die substrates are directly exposed to a biological material.