Prevention of substrate edge plating in a fountain plating process
US8172989B2 · kind B2 · utility
18Cited by
11References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 25, 2008 |
| Grant date | May 8, 2012 |
| Priority date | — |
| Expiry date | Nov 2, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/001
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plating apparatus and method for plating a surface of a substrate are described. Generally, the apparatus includes a double wall plating vessel having an inner cup and an outer cup peripherally surrounding and spaced apart from the inner cup. The inner cup has an inlet for receiving a plating solution and an outlet from which the plating solution overflows into a plenum defined between the inner and outer cups.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.