Methods and systems for forming microstructures in glass substrates
US8173038B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 18, 2008 |
| Grant date | May 8, 2012 |
| Priority date | — |
| Expiry date | Jan 31, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2204/08
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for forming microstructure cavities in a glass substrate includes directing a first laser pulse onto the glass substrate thereby forming a first microstructure cavity having a tapered configuration. The first laser pulse may have first spot area on the surface of the glass substrate. A second laser pulse having a second spot area on the surface of the glass substrate may be directed onto the glass substrate thereby forming a second microstructure cavity having a tapered configuration. The second spot area may be substantially the same as the first spot area and may overlap the first spot area such that a portion of the sidewall disposed between first microstructure cavity and the second microstructure cavity is ablated. After the portion of the sidewall is ablated, the diameter of each of the first and second microstructure cavities may be less than the diameter of the first spot area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.