White heat-curable silicone resin composition and optoelectronic part case
US8173053B2 · kind B2 · utility
2Cited by
17References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 8, 2009 |
| Grant date | May 8, 2012 |
| Priority date | — |
| Expiry date | Aug 23, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1352
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a thermal conductivity of 1-10 W/mK. The composition is useful for forming cases on optoelectronic parts, typically LED.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.