Nano-structure enhancements for anisotropic conductive adhesive and thermal interposers
US8173260B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2010 |
| Grant date | May 8, 2012 |
| Priority date | — |
| Expiry date | Jan 12, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2998
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention features additions of nano-structures to interconnect conductor fine particles (spheres) to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nano-structures at their surfaces; (2) improve the anisotropic conductive adhesive interconnection conductivity with microcircuit contact pads; and (3) allow lower compression forces to be applied during the microcircuit fabrication processes which then results in reduced deflection or circuit damage. When pressure is applied during fabrication to spread and compress anisotropic conductive adhesive and the matrix of interconnect particles and circuit conductors, the nano-structures mesh and compress into a more uniform connection than current technology provides, thereby eliminating voids, moisture and other contaminants, increasing the contact surfaces for better electrical and thermal conduction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.