Patent · US Active

Fabrication of electronic devices including flexible electrical circuits

US8173490B2 · kind B2 · utility

7Cited by
11References
21Claims
0Family size

Inventors

Key dates

Filing dateJan 18, 2011
Grant dateMay 8, 2012
Priority date—
Expiry dateJan 18, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/30107
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit structure is bonded directly to the die, and includes electrical conductors encapsulated by structural layers. Each electrical conductor contacts a respective electrical contact. The electronic device is encapsulated by the barrier film and one or more of the structural layers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.