Etchant composition, patterning conductive layer and manufacturing flat panel, display device using the same
US8173546B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Jun 23, 2011 |
| Grant date | May 8, 2012 |
| Priority date | — |
| Expiry date | Jun 23, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6743
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An etchant composition that allows simplification and optimization of semiconductor manufacturing process is presented, along with a method of patterning a conductive layer using the etchant and a method of manufacturing a flat panel display using the etchant. The etchant includes nitric acid, phosphoric acid, acetic acid, and an acetate compound in addition to water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.