Housing comprising a device for fixing an electronic component

US8173912B2 · kind B2 · utility

Assignee

• Conti Temic microelectronic GmbH · DE

Inventors

• Turhan Büyükbas · Erlangen, DE
• Jürgen Rietsch · Hof, DE
• Helmut Karrer · Bad Mergentheim, DE
• Jürgen Henniger · Erlangen, DE
• Matthias Gramann · Neunkirchen, DE
• Matthias Wieczorek · Lauf an der Pegnitz, DE
• Klaus Scharrer · Hohenstadt, DE
• Peter Guth · Nuremberg, DE
• Dirk Trodler · Koblenzer Straße, DE

Key dates

• Filing date: Mar 19, 2008
• Grant date: May 8, 2012
• Expiry date: Nov 6, 2028

Classification

• Technology area (CPC F): Mechanical Engineering; Lighting; Heating
• CPC primary: F16H61/0006
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A housing for retaining an electronic component, including a lid and a lower part made of synthetic material, wherein the lid is joined in a force-fit manner to the lower part by clamping geometry, and in order to affix the electronic component in position, the lid applies a specified force (F) to the electronic component after being joined to the lower part due to its design. Here, the lid is designed in such a manner that the force (F) applied lies within a specified force range (B), and that the clamping geometry comprises a groove on the lower part and a ridge on the lid which grips into the groove, wherein a clamp web on the lower part or on the lid is arranged in such a manner that the lid is removably clamped to the lower part after being joined to the lower part with a force (F) which acts parallel to the clamping force (KF).