Semiconductor arrangement having specially fashioned bond wires
US8174104B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 9, 2009 |
| Grant date | May 8, 2012 |
| Priority date | — |
| Expiry date | Nov 6, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor arrangement includes first and second integrated circuits (dies), an electrically conductive intermediate element, and one or more bond conductors. The first and the second integrated circuits are arranged in a package. The first integrated circuit has a first contact pad. The second integrated circuit has a second contact pad. The intermediate element is disposed on the second contact pad. The conductors electrically connect the first and the second integrated circuits. At least one of the bond conductors has a first end electrically connected to the first contact pad, and a second wedge shaped end electrically connected to the intermediate element. The bond conductor is made of a first material and the intermediate element is made of a second material which is softer than the first material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.