Method for fabricating a sensor, a sensor, and a method for sensing
US8174703B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2009 |
| Grant date | May 8, 2012 |
| Priority date | — |
| Expiry date | Jun 20, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2694
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for fabricating a sensor, a sensor so fabricated, and a method for sensing a stimulus are provided. The method includes providing an elongated open channel, such as, a V-groove, in a substrate, the open channel providing a first surface; removing at least some material from at least a portion of the open channel to provide a second surface displaced from the first surface; positioning a diaphragm on the second surface; and positioning an elongated wave-guide having a beveled end in the elongated open channel wherein the beveled end is positioned over the diaphragm to define an interferometric cavity between the diaphragm and the outer surface of the wave-guide. The sensor so fabricated can provide an effective sensor for detecting acoustic emission waves, among other pressure waves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.