Structure of heat dissipation substrate for power light emitting diode (LED) and a device using same
US8174832B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2008 |
| Grant date | May 8, 2012 |
| Priority date | — |
| Expiry date | Mar 11, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
Abstract
A structure of a heat dissipation substrate of power LEDs and a device made by using the same overcomes drawbacks such as complex structure of power LEDs, strict manufacturing process, low production efficiency, high production cost, and unreliable product quality. The structure of the heat dissipation substrate includes a one-piece circuit board having a counterbore and metal lines thereon, wherein the counterbore is formed by a through hole and a blind hole communicating with each other. The through hole is smaller than the blind hole, and both of them share the same direction of axis. The heat sink has a one-piece terraced structure formed by a upper terrace and a lower terrace; the heat sink matches the counterbore to form a firm fit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.