Methods and apparatus for transmitting vibrations
US8177705B2 · kind B2 · utility
42Cited by
128References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 5, 2010 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Nov 5, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2460/13
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for transmitting vibrations via an electronic and/or transducer assembly through a dental implant are disclosed herein. The assembly may be attached, adhered, or otherwise embedded into or upon the implant to form a hearing assembly. The electronic and transducer assembly may receive incoming sounds either directly or through a receiver to process and amplify the signals and transmit the processed sounds via a vibrating transducer element coupled to a tooth or other bone structure, such as the maxillary, mandibular, or palatine bone structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.