Organosilicate resin formulation for use in microelectronic devices
US8178159B2 · kind B2 · utility
11Cited by
22References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2004 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Sep 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02282
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Silane compositions having an aromatic functionality and a ethylenically functionality and comprising a latent acid catalyst are deposited in two or more layers on a substrate. Each layer differs in light absorption properties from an adjacent layer. Some layers may have different curing mechanisms. Such a method is useful in forming antireflective coatings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.